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Shanghai Pudong Dev Bank to issue RMB 30 bln bonds

Feb. 22, 2012 (China Knowledge) - Shanghai Pudong Development Bank<600000> has said it will issue RMB 30 billion worth of fixed-rate bonds with a maturity of five years on the interbank market from Feb. 24 to Feb. 28.

Coupon rate will be determined in the process of book-building. Both value date and payment due date is set on Feb. 28.

Proceeds from the issue will be used to replenish working capital and optimize debt structure, in a bid to offer loans to China's small enterprises.

China Lianhe Credit Rating Co Ltd has rated the issuer and bills AAA and AAA, respectively.

China International Capital Corp, the largest investment bank in the country, has been assigned as the lead underwriter and bookrunner. Haitong Securities Co Ltd<600837> will be the joint lead underwriter.

This will be the issuer's first bond this year.

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